We provide our customers with everything they need – hardware, software and services – to mass produce patterns on silicon, allowing them to increase the value and lower the cost of a chip.
EUV lithography systems
Providing highest resolution in high-volume manufacturing, our extreme ultraviolet lithography machines are pushing Moore’s Law forward.
DUV lithography systems
Our deep ultraviolet lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
DUV lithography systems
The TWINSCAN NXT:2000i is our state-of-the-art immersion lithography system currently being ramped in high-volume manufacturing of the 7 nm Logic and advanced DRAM nodes.
Introduced in 2015, the TWINSCAN NXT:1980Di delivers high productivity with high reliability: system uptime is at > 97% worldwide.
The TWINSCAN NXT:1970Ci delivers high productivity and excellent image resolution using a dual-stage concept.
The TWINSCAN XT:1460K is our latest-generation dual-stage ‘dry’ lithography system, offering a 30% productivity increase over previous models.
The TWINSCAN XT:1060K is ASML’s most advanced KrF (krypton fluoride) laser 'dry' lithography system.
The TWINSCAN XT:860M is designed using state-of-the-art optics for volume 300 mm wafer production at and below 110 nm resolution.
Delivering speed and accuracy, our metrology and inspection portfolio covers every step of the manufacturing process, from R&D to mass production. Together with our computational lithography and patterning control software solutions, they help chipmakers achieve the highest yield and best performance in mass production.
YieldStar optical metrology
Our YieldStar optical metrology solutions can quickly and accurately measure the quality of patterns on the wafer.
Fast and accurate pre-etch overlay and focus measurements, whatever your process conditions.
The YieldStar 380G is the successor of the YieldStar 375F, providing even faster and more accurate after-develop overlay and focus measurements.
Fast, accurate in-product overlay and CD metrology for after-etch process monitoring.
E-beam metrology and inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
Our highest resolution e-beam system offers CD metrology and defect detection for chip development and production monitoring.
HMI eScan 430
Fast e-beam inspection for process development and production monitoring for 3D NAND and other advanced chips.
Our computational lithography and software solutions revolve around creating applications that enhance the setup of the lithography system, so that chipmakers can print exactly what they want to print. A foundational element for all these applications are accurate simulation models of the lithography process. These models represent a wide variety of physical and chemical effects. Machine learning solutions are now broadly used both in the simulation models as well as in the applications. Our solutions fall into two main areas:
- Process window enhancement
- Process window control